As ball grid array packages move from 0.8 mm and 0.5 mm pitches toward 0.4 mm, 0.35 mm, and even 0.3 mm, the escape routing challenge quickly outpaces conventional PCB
As ball grid array packages move from 0.8 mm and 0.5 mm pitches toward 0.4 mm, 0.35 mm, and even 0.3 mm, the escape routing challenge quickly outpaces conventional PCB